Costa Rica has rapidly evolved into a regional hub for high-tech manufacturing, particularly in medical device assembly and microelectronics packaging. The demand for advanced thermal interface materials, such as our Tungsten Copper (WCu) and Molybdenum Copper (MoCu) alloys, is driven by the need for superior thermal conductivity and controlled CTE (Coefficient of Thermal Expansion) in precision hardware.
FOTMA provides the foundational material science that allows Costa Rican OEMs to push the boundaries of miniaturization in semiconductors and power electronics. Our materials provide the heat dissipation reliability required for high-frequency operations.
When silicon chips are mounted on heat sinks, the difference in expansion rates causes stress. Our WCu/MoCu materials can be tailored to match the chip's CTE, preventing failure under thermal cycling common in industrial environments.
