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Low Expansion Layers and Thermal Paths for Heat Sinks, Lead Frames, Multi-layer Printed Circuit Boards (PCBs), etc. Heat sink material on aircraft, heat sink material on radar.
| Grade | Density g/cm3 | Coefficient of thermal Expansion ×10-6 (20℃) | Thermal conductivity W/(M·K) |
|---|---|---|---|
| CMC111 | 9.32 | 8.8 | 305(XY)/250(Z) |
| CMC121 | 9.54 | 7.8 | 260(XY)/210(Z) |
| CMC131 | 9.66 | 6.8 | 244(XY)/190(Z) |
| CMC141 | 9.75 | 6 | 220(XY)/180(Z) |
| CMC13/74/13 | 9.88 | 5.6 | 200(XY)/170(Z) |



| Material | Wt% Molybdenum Content | g/cm3 Density | Thermal conductivity at 25℃ | Coefficient of thermal Expansion at 25℃ |
|---|---|---|---|---|
| S-CMC | 5 | 9.0 | 362 | 14.8 |
| 10 | 9.0 | 335 | 11.8 | |
| 13.3 | 9.1 | 320 | 10.9 | |
| 20 | 9.2 | 291 | 7.4 |