◆ 1. The tungsten copper electronic packaging material has an adjustable thermal expansion coefficient, which can be matched with different substrates (such as: stainless steel, valve alloy, silicon, gallium arsenide, gallium nitride, aluminum oxide, etc.);
◆ 2. No sintering activation elements are added to maintain good thermal conductivity;
◆ 3. Low porosity and good air tightness;
◆ 4. Good size control, surface finish and flatness;
◆ 5. Provide sheet, formed parts, also can meet the needs of electroplating.
What is tungsten copper electronic packaging material?It is a composite material combining the low expansion of tungsten and the high thermal conductivity of copper.
Can the thermal expansion coefficient be adjusted?Yes, it can be customized by adjusting the composition ratio to match various substrates.
Is this material suitable for high-power devices?Yes, it is highly suitable for high-power device packaging due to its excellent heat dissipation properties.
Are there sintering additives in FOTMA's products?No, no sintering activation elements are added, ensuring superior thermal conductivity.
What forms of product are available?We provide sheets
, formed parts, and can accommodate custom electroplating requirements.
