As industrial demand in India grows, FOTMA provides high-performance thermal management solutions for the Mumbai electronics corridor. We specialize in Molybdenum-Copper (MoCu) and Tungsten-Copper (WCu) composites, essential for high-power semiconductor packaging.
Send Inquiry NowMumbai, the financial and industrial hub of India, is seeing a shift toward high-end electronic manufacturing. From server farms to specialized telecommunications equipment, the need for heat dissipation has never been higher. FOTMA leverages 30+ years of expertise to provide localized supply chain support for Mumbai’s burgeoning tech firms.
With 5G expansion and local chip fabrication initiatives, thermal conductivity requirements are tightening. Our R&D focuses on optimizing the Coefficient of Thermal Expansion (CTE) to match Silicon (Si) and Gallium Nitride (GaN) substrates, ensuring zero fatigue in high-heat electronics.
Optimized for power modules.
Tailored for specific semiconductors.
ISO 9001:2015 certified process.
Q: Can FOTMA handle custom designs for Mumbai-based engineering firms?
A: Absolutely. We offer full CAD/CAM support and prototype fabrication based on your specific thermal load requirements.
Q: What is the benefit of using MoCu over pure Copper?
A: While copper has higher conductivity, MoCu offers adjustable thermal expansion, which is critical to preventing crack formation in silicon chips during extreme temperature cycling.
